Nanofoil itself is a heat source consisting of multi layers of Ni and Al. When placed between two solder applied surfaces prepared in the similar manner of an indium bond, pressure is applied, and an electrical pulse is sent to the nanofoil. This creates an exothermic reaction of the nanofoil and melts the two solder prepared surfaces together in fractions of a second. Like an elastomer bond, the zero-stress point of the bond is close to room temperature, so the components stay in original dimension. Another advantage is the solder used can be nearly any solder alloy 235C or less. Like any bonding system, there are some disadvantages. Even though the operational temperature can be higher, the target material will be subjected to tensile stresses in operation. Most ceramics handle compressive stresses quite well, as is the case for a traditional indium bonding, but are poor with tensile stresses.