Thermal Conductive Bonding, Inc.
TCB was formed in 1998. Our experts, both engineers and management, have decades of collective experience in providing bonding solutions to the high-technology community. Since its inception, TCB has become a recognized leader in joining materials.
TCB’s ongoing R&D programs have enabled the company to lead the competition in providing innovative, viable and economically attractive solutions to a continually changing marketplace.
leader in joining materials
We are also finding an ever increasing number of applications requiring bonding solutions in today’s advanced product technology. Our bonding techniques continue to prove themselves highly adaptable and able to accommodate different and varied applications.
Industries and markets where our proprietary techniques are applied currently include disk drives, flash memory, semiconductors, solar energy, coated glass, flat panel technology, fluid dispensing, and laser technologies.